The fast development of the integrated circuits (ICs) enables the realization of miniaturized communication systems. Except for the useful radiation in the communication, on the other hand, most circuits in a miniaturized system suffer from the harmful electromagnetic interference (EMI). The EMI brings several significant challenges to practical engineering: First, it is hard to quantitively calculate and analyze the complex EMI without using large computing resource due to the large density and multi-scale of the circuits. Secondly, there is little novel EMI suppressing strategy in the near-field since the transmitting/coupling power in near-field is much more complex than that in the far-field. In this special session, speakers will share their recent works on the methods of analyzing, modeling and suppressing complex EMI in miniaturized ICs and their packages such as 2-D/3-D interconnects, power ground networks, heatsink packages, multilayered circuits, shielding microwave cavities, etc.